Composites
M+P Labs can evaluate the chemical, thermal, microstructural, mechanical and electrical properties of composite materials all under one roof, helping you to design new products, meet specifications (i.e. IPC, NEMA LI-1, Mil spec) and more.
Chemical Analysis
- Chemical composition
- Water absorption
- Chemical exposure
- Resin/filler content
Microstructural/Image Analysis
- Void content
- Bonding failures
- Lamination issues
Thermal Analysis
DSC:
- Glass transition
- Melting, heat of fusion
- Thermal stability
- Oxidation onset
- Cure onset, degree of cure
- Crystallization, % crystallinity, heat of crystallization
- Behavior under specific conditions of force, temperature profile, atmosphere and time
- Coefficient of thermal expansion
SDT:
- Compositional analysis
- Simultaneous DSC/TGA/DTA
- Carbon black, ash, & filler content
- TGA, decomposition kinetics
TMA:
- Coefficient of thermal expansion, glass transition
- Penetration, softening, melting
- Stress/strain properties of films/fibers
- Multi-layer film analysis
- 3-point bending (flexure)
Mechanical Properties
- Tensile
- Flexural
- Bond strength
- Shear
Electrical Testing
- Dielectric
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Capabilities Summary
